P‐189: The Technological Study for Side Etch about ITO Stacked OC Layer on Touch Panel

The paper is mainly studied that side etch has the relation with ITO stacked OC layer on touch panel; And OC is served as insulating layer used between the electrode of Tx and Rx, the compactness of ITO film has the important influence on temperature and high humidity reliability evaluation. The res...

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Bibliographic Details
Published in:SID International Symposium Digest of technical papers 2018-05, Vol.49 (1), p.1876-1879
Main Authors: Zeng, Ting, Shao, Xibin, guo, Zongjie, Zhang, Ming, Ding, Xianlin, Chen, Qicheng, Du, Zhi, Yin, Liuyue, qian, Yijie, Zhang, Yuzhao, Yang, Hong
Format: Article
Language:English
Subjects:
ITO Process
Materials selection
Product reliability
Reliability analysis
Side Etch
Sputtering
Touch
Touch Panel
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Summary:The paper is mainly studied that side etch has the relation with ITO stacked OC layer on touch panel; And OC is served as insulating layer used between the electrode of Tx and Rx, the compactness of ITO film has the important influence on temperature and high humidity reliability evaluation. The result is product reliability. The issue of side etch would be electrical disconnection, as to the product work not properly in high suggested that main factors of side etch were the choice of OC materials, and ITO sputtering technique, in addition to the thickness, but can't be improved thoroughly only from optimizing OC materials. Therefore, ITO process, sputtering temperature and depositing power, improved completely the issue of side etch on OC.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.12439