Fabrication of low defect density 3C-SiC on SiO2 structures using wafer bonding techniques

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Bibliographic Details
Published in:Journal of electronic materials 1998-03, Vol.27 (3), p.L17-L20
Main Authors: VINOD, K. N, ZORMAN, C. A, YASSEEN, A. A, MEHREGANY, M
Format: Article
Language:English
Subjects:
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-998-0207-z