Electromigration-induced damage in bamboo Al interconnects

Saved in:
Bibliographic Details
Published in:Journal of electronic materials 2002, Vol.31 (1), p.45-49
Main Authors: BÖHM, J, VOLKERT, C. A, MÖNIG, R, BALK, T. J, ARZT, E
Format: Article
Language:English
Subjects:
Applied sciences
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-002-0171-y