The Interfacial Reaction between Sn-Zn-Ag-Ga-AI Solders and Metallized Cu Substrates

The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-O.1A1 solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-...

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Bibliographic Details
Published in:Journal of electronic materials 2004-01, Vol.33 (1), p.7
Main Authors: Chiang-Ming, Chuang, Hung, Hui-Tzu, Pei-Chi, Liu, Kwang-Lung, Lin
Format: Article
Language:English
Subjects:
Interfacial bonding
Intermetallic compounds
Soldering
Online Access:Get full text
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Summary:The interfacial interaction between the Sn-8.55Zn-0.5Ag-0.5Ga-O.1A1 solder and three kinds of metallized substrates (Cu, Cu/Au, and Cu/Ni-P/Au) does not form the Cu-Sn intermetallic compound (IMC). Continuous Cu-Zn and discontinuous Ag-Zn interfacial IMC layers formed between the Cu and Sn-Zn-Ag-Ga-Al solder, while Cu-Zn and Au-Al-Zn IMCs formed on the Cu/Au substrate. Only the Au-Al-Zn IMC formed at the interface when the electroless Ni-P deposit was the diffusion barrier between Cu and the Au surface layer. [PUBLICATION ABSTRACT]
ISSN:0361-5235
1543-186X