Numerical Analysis of Passive Intermodulation Arisen From Nonlinear Contacts in HPMW Devices

A novel field-circuit hybrid numerical method is proposed to analyze the passive intermodulation (PIM) caused by nonlinear contacts. In this hybrid numerical method, the electromagnetic field part is simulated by a self-developed time-domain finite integration theory. Meanwhile, the circuit part is...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2018-10, Vol.60 (5), p.1470-1480
Main Authors: You, Jian Wei, Zhang, Jian Feng, Gu, Wei Hui, Cui, Wan Zhao, Cui, Tie Jun
Format: Article
Language:English
Subjects:
Circuits
Computer simulation
Couplings
Electromagnetic fields
Equivalent circuits
field-circuit hybrid method
Finite-difference time domain (FDTD)
high-power-microwave (HPMW) devices
Integrated circuit modeling
Intermodulation
Junctions
Mathematical model
Mathematical models
nonlinear lumped element (NLE)
Numerical analysis
Numerical methods
Numerical models
passive intermodulation (PIM)
Powder injection molding
Time-domain analysis
time-domain finite integration theory (TDFIT)
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Summary:A novel field-circuit hybrid numerical method is proposed to analyze the passive intermodulation (PIM) caused by nonlinear contacts. In this hybrid numerical method, the electromagnetic field part is simulated by a self-developed time-domain finite integration theory. Meanwhile, the circuit part is modeled by a number of nonlinear lumped elements, which can introduce the nonlinear feature of nonlinear contacts. After solving a multiscale problem, the field part and the circuit part can couple with each other self-consistently via the generalized Ampere's equation. To verify the accuracy of the proposed method, a practical example is discussed. The results show that the frequencies of each PIM order can match analytical results very well. Moreover, the PIM levels calculated by the proposed numerical method have a very good agreement with the measured results.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2017.2761024