Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

Evolution behavior and growth kinetics of Sn/Cu interfacial intermetallic compound (IMC) during multiple reflows were investigated. Scanning electron microscope (SEM) and shanghai synchrotron radiation facility (SSRF) images have shown that, scallop Cu6Sn5, formed at interface during the heating sta...

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Bibliographic Details
Published in:Intermetallics 2018-05, Vol.96, p.1-12
Main Authors: Ma, H.R., Kunwar, A., Shang, S.Y., Jiang, C.R., Wang, Y.P., Ma, H.T., Zhao, N.
Format: Article
Language:English
Subjects:
A Intermetallics
B In situ
C Joining
Cooling
Copper
D Interfaces
E Finite-element modeling
Evolution
Finite element analysis
Heating
Intermetallic compounds
Kinetics
Scanning electron microscopy
Soldering
Synchrotron radiation
Tin
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Summary:Evolution behavior and growth kinetics of Sn/Cu interfacial intermetallic compound (IMC) during multiple reflows were investigated. Scanning electron microscope (SEM) and shanghai synchrotron radiation facility (SSRF) images have shown that, scallop Cu6Sn5, formed at interface during the heating stage of a reflow, converted to facet type during subsequent cooling, and transformed back to the scalloped grains with larger size during the next re-heating stage. Furthermore, the value of IMC growth time exponent n during soldering gradually changed from 0.405 to 0.485 while nearly kept 1 during cooling and heating with reflow times. In addition, n was 0.613 for the overall multiple reflow process. [Display omitted]
ISSN:0966-9795
1879-0216
DOI:10.1016/j.intermet.2018.01.022