Wettability Induced Crack Dynamics and Morphology

Substrate wettability alteration induced control over crack formation process in thin colloidal films has been addressed in the present study. Colloidal nanosuspension (53nm, mean particle diameter) droplets have been subjected to natural drying to outline the effects of substrate surface energies o...

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Bibliographic Details
Published in:arXiv.org 2014-12
Main Authors: Ghosh, Udita Uday, Chakraborty, Monojit, Aditya Bikram Bhandari, Chakraborty, Suman, DasGupta, Sunando
Format: Article
Language:English
Subjects:
Colloiding
Cracks
Drying
Hydrophobicity
Morphology
Particle size
Substrates
Thin films
Wettability
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Summary:Substrate wettability alteration induced control over crack formation process in thin colloidal films has been addressed in the present study. Colloidal nanosuspension (53nm, mean particle diameter) droplets have been subjected to natural drying to outline the effects of substrate surface energies over the dry-out characteristics with emphasis on crack dynamics, crack morphology and underlying particle arrangements. Experimental findings indicate that number of cracks formed decreases with increase in substrate hydrophobicity. These physical phenomena have been explained based on the magnitude of stress dissipation incurred by the substrate. DLVO predictions are also found to be in tune with the reported experimental investigations.
ISSN:2331-8422