High aspect ratio silver grid transparent electrodes using UV embossing process

This study presents a UV embossing process to fabricate high aspect ratio silver grid transparent electrodes on a polymer film. Transparent electrodes with a high optical transmittance (93 %) and low sheet resistance (4.6 Ω/sq) were fabricated without any high temperature or vacuum processes. The st...

Full description

Saved in:
Bibliographic Details
Published in:AIP advances 2017-10, Vol.7 (10), p.105218-105218-7
Main Authors: Kim, Dong Jin, Lim, Mikyung, Lee, Seung S., Kim, Jin-Ha
Format: Article
Language:English
Subjects:
Adhesive strength
Electrical resistivity
Electrodes
Embossing
High aspect ratio
Mass production
Multilayers
Polymer films
Touch control panels
Transmittance
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This study presents a UV embossing process to fabricate high aspect ratio silver grid transparent electrodes on a polymer film. Transparent electrodes with a high optical transmittance (93 %) and low sheet resistance (4.6 Ω/sq) were fabricated without any high temperature or vacuum processes. The strong adhesion force between the UV resin and the silver ink enables the fabrication of silver microstructures with an aspect ratio higher than 3. The high aspect ratio results in a low sheet resistance while maintaining a high optical transmittance. Multi-layer transparent electrodes were fabricated by repeating the proposed UV process. Additionally, a large-area of 8-inch touch panel was fabricated with the proposed UV process. The proposed UV process is a relatively simple and low cost process making it suitable for large-area production as well as mass production.
ISSN:2158-3226
2158-3226
DOI:10.1063/1.5009395