Spatially resolved measurements of grain size effects on the shock and spall response of quasi-Taylor wave loaded pure copper

Quasi-Taylor wave loaded plate impact experiments have been used to study the effects of bulk grain size on the shock and spall response of pure copper samples. Using line-Velocity Interferometry System for Any Reflector velocimetry, an increased particle velocity dispersion was measured for larger...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied physics 2017-07, Vol.122 (3)
Main Authors: Whiteman, G., Owen, G. D., De'Ath, J., Chapman, D. J., Eakins, D. E., Turner, J. G., Millett, J. C. F.
Format: Article
Language:English
Subjects:
Applied physics
Copper
Free surfaces
Grain size
Plate impact tests
Size effects
Strain rate
Surface layers
Tensile strain
Velocimetry
Velocity
Velocity measurement
Voids
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Quasi-Taylor wave loaded plate impact experiments have been used to study the effects of bulk grain size on the shock and spall response of pure copper samples. Using line-Velocity Interferometry System for Any Reflector velocimetry, an increased particle velocity dispersion was measured for larger bulk grain size samples resulting in lower mean peak particle velocities and a lower reload velocity following spall. Spall voids were located in a surface layer of similarly sized grains for both bulk grain size materials tested. The spall strength was observed to vary with the tensile strain-rate but was unaffected by the bulk grain size. Post-mortem studies of voids in samples showed narrow void planes for the small bulk grain size materials and a larger spread of voids in the larger bulk grain size materials consistent with the free surface particle velocity data and observed particle velocity dispersion.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.4986626