Thermal analysis of continuous and patterned multilayer films in the presence of a nanoscale hot spot

Thermal responses of multilayer films play essential roles in state-of-the-art electronic systems, such as photo/micro-electronic devices, data storage systems, and silicon-on-insulator transistors. In this paper, we focus on the thermal aspects of multilayer films in the presence of a nanoscale hot...

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Bibliographic Details
Published in:AIP advances 2016-10, Vol.6 (10), p.105102-105102-7
Main Authors: Juang, Jia-Yang, Zheng, Jinglin
Format: Article
Language:English
Subjects:
Data storage
Electronic devices
Electronic systems
Laser beam heating
Magnetic recording
Mathematical models
Modelling
Multilayers
Power consumption
Semiconductor devices
Storage systems
Temperature distribution
Thermal analysis
Thermal barriers
Thin films
Transistors
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Summary:Thermal responses of multilayer films play essential roles in state-of-the-art electronic systems, such as photo/micro-electronic devices, data storage systems, and silicon-on-insulator transistors. In this paper, we focus on the thermal aspects of multilayer films in the presence of a nanoscale hot spot induced by near field laser heating. The problem is set up in the scenario of heat assisted magnetic recording (HAMR), the next-generation technology to overcome the data storage density limit imposed by superparamagnetism. We characterized thermal responses of both continuous and patterned multilayer media films using transient thermal modeling. We observed that material configurations, in particular, the thermal barriers at the material layer interfaces crucially impact the temperature field hence play a key role in determining the hot spot geometry, transient response and power consumption. With a representative generic media model, we further explored the possibility of optimizing thermal performances by designing layers of heat sink and thermal barrier. The modeling approach demonstrates an effective way to characterize thermal behaviors of micro and nano-scale electronic devices with multilayer thin film structures. The insights into the thermal transport scheme will be critical for design and operations of such electronic devices.
ISSN:2158-3226
2158-3226
DOI:10.1063/1.4964497