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Gas cluster ion beam assisted NiPt germano-silicide formation on SiGe
We report the formation of very uniform and smooth Ni(Pt)Si on epitaxially grown SiGe using Si gas cluster ion beam treatment after metal-rich silicide formation. The gas cluster ion implantation process was optimized to infuse Si into the metal-rich silicide layer and lowered the NiSi nucleation te...
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Published in: | Journal of applied physics 2016-04, Vol.119 (15) |
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container_title | Journal of applied physics |
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creator | Ozcan, Ahmet S. Lavoie, Christian Alptekin, Emre Jordan-Sweet, Jean Zhu, Frank Leith, Allen Pfeifer, Brian D. LaRose, J. D. Russell, N. M. |
description | We report the formation of very uniform and smooth Ni(Pt)Si on epitaxially grown SiGe using Si gas cluster ion beam treatment after metal-rich silicide formation. The gas cluster ion implantation process was optimized to infuse Si into the metal-rich silicide layer and lowered the NiSi nucleation temperature significantly according to in situ X-ray diffraction measurements. This novel method which leads to more uniform films can also be used to control silicide depth in ultra-shallow junctions, especially for high Ge containing devices, where silicidation is problematic as it leads to much rougher interfaces. |
doi_str_mv | 10.1063/1.4947054 |
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D.</creatorcontrib><creatorcontrib>Russell, N. M.</creatorcontrib><creatorcontrib>Brookhaven National Lab. (BNL), Upton, NY (United States)</creatorcontrib><title>Gas cluster ion beam assisted NiPt germano-silicide formation on SiGe</title><title>Journal of applied physics</title><description>We report the formation of very uniform and smooth Ni(Pt)Si on epitaxially grown SiGe using Si gas cluster ion beam treatment after metal-rich silicide formation. The gas cluster ion implantation process was optimized to infuse Si into the metal-rich silicide layer and lowered the NiSi nucleation temperature significantly according to in situ X-ray diffraction measurements. This novel method which leads to more uniform films can also be used to control silicide depth in ultra-shallow junctions, especially for high Ge containing devices, where silicidation is problematic as it leads to much rougher interfaces.</description><subject>Applied physics</subject><subject>C-MOS</subject><subject>Clusters</subject><subject>Depth profiling techniques</subject><subject>Epitaxial growth</subject><subject>Epitaxy</subject><subject>Intermetallic compounds</subject><subject>Ion beams</subject><subject>Ion implantation</subject><subject>Materials modification</subject><subject>Nickel compounds</subject><subject>Nickel silicide</subject><subject>PHYSICS OF ELEMENTARY PARTICLES AND FIELDS</subject><subject>Platinum compounds</subject><subject>Scanning electron microscopy</subject><subject>Semiconductor device fabrication</subject><subject>Silicide</subject><subject>Silicon germanides</subject><subject>Solid solid interfaces</subject><subject>X-ray diffraction</subject><issn>0021-8979</issn><issn>1089-7550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqd0M1KAzEQAOAgCtbqwTdY9KSwNbPJNslRSq1CUcHew-5sointpiap4Nub2oJ3YWBg-Jg_Qi6BjoCO2R2MuOKC1vyIDIBKVYq6psdkQGkFpVRCnZKzGJeUAkimBmQ6a2KBq21MJhTO90VrmnXRxOhypSue3Wsq3k1YN70vo1s5dJ0prM-FtNM53tzMnJMT26yiuTjkIVk8TBeTx3L-Mnua3M9LZFKlPB_BtK3iY-yYMHzcMsEqaZA3nRQgeIUWaQvKUIROcLBVrYxsLLPIObIhudq39TE5HdElgx_o-95g0sBqzoTI6HqPNsF_bk1Meum3oc9r6QoqkCBkxbK62SsMPsZgrN4Et27Ctwaqd5_UoA-fzPZ2b3cTf-_-H_7y4Q_qTWfZD4dBgEo</recordid><startdate>20160421</startdate><enddate>20160421</enddate><creator>Ozcan, Ahmet S.</creator><creator>Lavoie, Christian</creator><creator>Alptekin, Emre</creator><creator>Jordan-Sweet, Jean</creator><creator>Zhu, Frank</creator><creator>Leith, Allen</creator><creator>Pfeifer, Brian D.</creator><creator>LaRose, J. 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(BNL), Upton, NY (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Gas cluster ion beam assisted NiPt germano-silicide formation on SiGe</atitle><jtitle>Journal of applied physics</jtitle><date>2016-04-21</date><risdate>2016</risdate><volume>119</volume><issue>15</issue><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>We report the formation of very uniform and smooth Ni(Pt)Si on epitaxially grown SiGe using Si gas cluster ion beam treatment after metal-rich silicide formation. The gas cluster ion implantation process was optimized to infuse Si into the metal-rich silicide layer and lowered the NiSi nucleation temperature significantly according to in situ X-ray diffraction measurements. 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source | American Institute of Physics:Jisc Collections:Transitional Journals Agreement 2021-23 (Reading list) |
subjects | Applied physics C-MOS Clusters Depth profiling techniques Epitaxial growth Epitaxy Intermetallic compounds Ion beams Ion implantation Materials modification Nickel compounds Nickel silicide PHYSICS OF ELEMENTARY PARTICLES AND FIELDS Platinum compounds Scanning electron microscopy Semiconductor device fabrication Silicide Silicon germanides Solid solid interfaces X-ray diffraction |
title | Gas cluster ion beam assisted NiPt germano-silicide formation on SiGe |
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