Dry efficient cleaning of poly-methyl-methacrylate residues from graphene with high-density H2 and H2-N2 plasmas

Graphene is the first engineering electronic material, which is purely two-dimensional: it consists of two exposed sp2-hybridized carbon surfaces and has no bulk. Therefore, surface effects such as contamination by adsorbed polymer residues have a critical influence on its electrical properties and...

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Bibliographic Details
Published in:Journal of applied physics 2015-09, Vol.118 (12)
Main Authors: Cunge, G., Ferrah, D., Petit-Etienne, C., Davydova, A., Okuno, H., Kalita, D., Bouchiat, V., Renault, O.
Format: Article
Language:English
Subjects:
Applied physics
Cleaning
Contaminants
Contamination
Density
Electrical properties
Electronic materials
Graphene
Heterostructures
Plasmas (physics)
Residues
Selective surfaces
Substrates
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Summary:Graphene is the first engineering electronic material, which is purely two-dimensional: it consists of two exposed sp2-hybridized carbon surfaces and has no bulk. Therefore, surface effects such as contamination by adsorbed polymer residues have a critical influence on its electrical properties and can drastically hamper its widespread use in devices fabrication. These contaminants, originating from mandatory technological processes of graphene synthesis and transfer, also impact fundamental studies of the electronic and structural properties at the atomic scale. Therefore, graphene-based technology and research requires “soft” and selective surface cleaning techniques dedicated to limit or to suppress this surface contamination. Here, we show that a high-density H2 and H2-N2 plasmas can be used to selectively remove polymeric residues from monolayer graphene without any damage on the graphene surface. The efficiency of this dry-cleaning process is evidenced unambiguously by a set of spectroscopic and microscopic methods, providing unprecedented insights on the cleaning mechanisms and highlighting the role of specific poly-methyl-methacrylate residues at the graphene interface. The plasma is shown to perform much better cleaning than solvents and has the advantage to be an industrially mature technology adapted to large area substrates. The process is transferable to other kinds of two-dimensional material and heterostructures.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.4931370