Conductive cooling in white organic light emitting diode for enhanced efficiency and life time

We demonstrate white organic light emitting diodes with enhanced efficiency (26.8 lm/W) and life time (∼11 000 h) by improved heat dissipation through encapsulation composed of a metal (Cu, Mo, and Al) and mica sheet joined using thermally conducting epoxy. Finite element simulation is used to find...

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Bibliographic Details
Published in:Applied physics letters 2015-01, Vol.106 (1)
Main Authors: Tyagi, Priyanka, Kumar, Arunandan, Giri, Lalat Indu, Tuli, Suneet, Srivastava, Ritu
Format: Article
Language:English
Subjects:
Aluminum
Applied physics
Cooling
Copper
Efficiency
Encapsulation
Finite element method
Mica
Organic light emitting diodes
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Summary:We demonstrate white organic light emitting diodes with enhanced efficiency (26.8 lm/W) and life time (∼11 000 h) by improved heat dissipation through encapsulation composed of a metal (Cu, Mo, and Al) and mica sheet joined using thermally conducting epoxy. Finite element simulation is used to find effectiveness of these encapsulations for heat transfer. Device temperature is reduced by about 50% with the encapsulation. This, consequently, has improved efficiency and life time by about 30% and 60%, respectively, with respect to glass encapsulation. Conductive cooling of device is suggested as the possible cause for this enhancement.
ISSN:0003-6951
1077-3118
DOI:10.1063/1.4903800