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Nitride passivation reduces interfacial traps in atomic-layer-deposited Al2O3/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition
Using an atmospheric metal-organic chemical vapor deposition system, we passivated GaAs with AlN prior to atomic layer deposition of Al2O3. This AlN passivation incorporated nitrogen at the Al2O3/GaAs interface, improving the capacitance-voltage (C–V) characteristics of the resultant metal-oxide-sem...
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Published in: | Applied physics letters 2014-07, Vol.105 (3) |
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creator | Aoki, T. Fukuhara, N. Osada, T. Sazawa, H. Hata, M. Inoue, T. |
description | Using an atmospheric metal-organic chemical vapor deposition system, we passivated GaAs with AlN prior to atomic layer deposition of Al2O3. This AlN passivation incorporated nitrogen at the Al2O3/GaAs interface, improving the capacitance-voltage (C–V) characteristics of the resultant metal-oxide-semiconductor capacitors (MOSCAPs). The C–V curves of these devices showed a remarkable reduction in the frequency dispersion of the accumulation capacitance. Using the conductance method at various temperatures, we extracted the interfacial density of states (Dit). The Dit was reduced over the entire GaAs band gap. In particular, these devices exhibited Dit around the midgap of less than 4 × 1012 cm−2eV−1, showing that AlN passivation effectively reduced interfacial traps in the MOS structure. |
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This AlN passivation incorporated nitrogen at the Al2O3/GaAs interface, improving the capacitance-voltage (C–V) characteristics of the resultant metal-oxide-semiconductor capacitors (MOSCAPs). The C–V curves of these devices showed a remarkable reduction in the frequency dispersion of the accumulation capacitance. Using the conductance method at various temperatures, we extracted the interfacial density of states (Dit). The Dit was reduced over the entire GaAs band gap. In particular, these devices exhibited Dit around the midgap of less than 4 × 1012 cm−2eV−1, showing that AlN passivation effectively reduced interfacial traps in the MOS structure.</description><identifier>ISSN: 0003-6951</identifier><identifier>EISSN: 1077-3118</identifier><identifier>DOI: 10.1063/1.4891431</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Aluminum nitride ; Aluminum oxide ; Applied physics ; Atomic layer epitaxy ; Capacitance ; Capacitors ; Chemical vapor deposition ; Metal oxide semiconductors ; Metalorganic chemical vapor deposition ; Organic chemicals ; Organic chemistry ; Passivity ; Resistance</subject><ispartof>Applied physics letters, 2014-07, Vol.105 (3)</ispartof><rights>2014 AIP Publishing LLC.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c323t-6f5525e16b6c79fd7b6026a41b80eba1d8a5699f6e3eab73506b2b4736f186763</citedby><cites>FETCH-LOGICAL-c323t-6f5525e16b6c79fd7b6026a41b80eba1d8a5699f6e3eab73506b2b4736f186763</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,782,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Aoki, T.</creatorcontrib><creatorcontrib>Fukuhara, N.</creatorcontrib><creatorcontrib>Osada, T.</creatorcontrib><creatorcontrib>Sazawa, H.</creatorcontrib><creatorcontrib>Hata, M.</creatorcontrib><creatorcontrib>Inoue, T.</creatorcontrib><title>Nitride passivation reduces interfacial traps in atomic-layer-deposited Al2O3/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition</title><title>Applied physics letters</title><description>Using an atmospheric metal-organic chemical vapor deposition system, we passivated GaAs with AlN prior to atomic layer deposition of Al2O3. 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In particular, these devices exhibited Dit around the midgap of less than 4 × 1012 cm−2eV−1, showing that AlN passivation effectively reduced interfacial traps in the MOS structure.</description><subject>Aluminum nitride</subject><subject>Aluminum oxide</subject><subject>Applied physics</subject><subject>Atomic layer epitaxy</subject><subject>Capacitance</subject><subject>Capacitors</subject><subject>Chemical vapor deposition</subject><subject>Metal oxide semiconductors</subject><subject>Metalorganic chemical vapor deposition</subject><subject>Organic chemicals</subject><subject>Organic chemistry</subject><subject>Passivity</subject><subject>Resistance</subject><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNo1kctOwzAQRS0EEuWx4A8ssaELF0_cOMmyQlCQEGxgHU2cCRilcbDdin4Zv4cLZTUPzT13pMvYBcgZSK2uYTYvK5grOGATkEUhFEB5yCZSSiV0lcMxOwnhI415ptSEfT_Z6G1LfMQQ7AajdQP31K4NBW6HSL5DY7Hn0eO423CMbmWN6HFLXrQ0umAjtXzRZ8_qeomLwK-khClfUcReuK8EF4GSxA2JGp3nBsfETF3g62CHt4RcuTC-k7fmX-bfcEiTed8pk_0Gx6Tc26Ufz9hRh32g8309Za93ty839-Lxeflws3gURmUqCt3leZYT6EabouraotEy0ziHppTUILQl5rqqOk2KsClULnWTNfNC6Q5KXWh1yi7_uKN3n2sKsf5waz8kyzqDTOclwO_V9O_KeBeCp64evV2h39Yg610uNdT7XNQPoVOCxw</recordid><startdate>20140721</startdate><enddate>20140721</enddate><creator>Aoki, T.</creator><creator>Fukuhara, N.</creator><creator>Osada, T.</creator><creator>Sazawa, H.</creator><creator>Hata, M.</creator><creator>Inoue, T.</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20140721</creationdate><title>Nitride passivation reduces interfacial traps in atomic-layer-deposited Al2O3/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition</title><author>Aoki, T. ; Fukuhara, N. ; Osada, T. ; Sazawa, H. ; Hata, M. ; Inoue, T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c323t-6f5525e16b6c79fd7b6026a41b80eba1d8a5699f6e3eab73506b2b4736f186763</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Aluminum nitride</topic><topic>Aluminum oxide</topic><topic>Applied physics</topic><topic>Atomic layer epitaxy</topic><topic>Capacitance</topic><topic>Capacitors</topic><topic>Chemical vapor deposition</topic><topic>Metal oxide semiconductors</topic><topic>Metalorganic chemical vapor deposition</topic><topic>Organic chemicals</topic><topic>Organic chemistry</topic><topic>Passivity</topic><topic>Resistance</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Aoki, T.</creatorcontrib><creatorcontrib>Fukuhara, N.</creatorcontrib><creatorcontrib>Osada, T.</creatorcontrib><creatorcontrib>Sazawa, H.</creatorcontrib><creatorcontrib>Hata, M.</creatorcontrib><creatorcontrib>Inoue, T.</creatorcontrib><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Applied physics letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Aoki, T.</au><au>Fukuhara, N.</au><au>Osada, T.</au><au>Sazawa, H.</au><au>Hata, M.</au><au>Inoue, T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Nitride passivation reduces interfacial traps in atomic-layer-deposited Al2O3/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition</atitle><jtitle>Applied physics letters</jtitle><date>2014-07-21</date><risdate>2014</risdate><volume>105</volume><issue>3</issue><issn>0003-6951</issn><eissn>1077-3118</eissn><abstract>Using an atmospheric metal-organic chemical vapor deposition system, we passivated GaAs with AlN prior to atomic layer deposition of Al2O3. This AlN passivation incorporated nitrogen at the Al2O3/GaAs interface, improving the capacitance-voltage (C–V) characteristics of the resultant metal-oxide-semiconductor capacitors (MOSCAPs). The C–V curves of these devices showed a remarkable reduction in the frequency dispersion of the accumulation capacitance. Using the conductance method at various temperatures, we extracted the interfacial density of states (Dit). The Dit was reduced over the entire GaAs band gap. In particular, these devices exhibited Dit around the midgap of less than 4 × 1012 cm−2eV−1, showing that AlN passivation effectively reduced interfacial traps in the MOS structure.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.4891431</doi></addata></record> |
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subjects | Aluminum nitride Aluminum oxide Applied physics Atomic layer epitaxy Capacitance Capacitors Chemical vapor deposition Metal oxide semiconductors Metalorganic chemical vapor deposition Organic chemicals Organic chemistry Passivity Resistance |
title | Nitride passivation reduces interfacial traps in atomic-layer-deposited Al2O3/GaAs (001) metal-oxide-semiconductor capacitors using atmospheric metal-organic chemical vapor deposition |
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