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The thickness design of unintentionally doped GaN interlayer matched with background doping level for InGaN-based laser diodes

In order to reduce the internal optical loss of InGaN laser diodes, an unintentionally doped GaN (u-GaN) interlayer is inserted between InGaN/GaN multiple quantum well active region and Al0.2Ga0.8N electron blocking layer. The thickness design of u-GaN interlayer matching up with background doping l...

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Bibliographic Details
Published in:AIP advances 2016-03, Vol.6 (3), p.035124-035124-9
Main Authors: Chen, P., Zhao, D. G., Jiang, D. S., Zhu, J. J., Liu, Z. S., Yang, J., Li, X., Le, L. C., He, X. G., Liu, W., Li, X. J., Liang, F., Zhang, B. S., Yang, H., Zhang, Y. T., Du, G. T.
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Language:English
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Summary:In order to reduce the internal optical loss of InGaN laser diodes, an unintentionally doped GaN (u-GaN) interlayer is inserted between InGaN/GaN multiple quantum well active region and Al0.2Ga0.8N electron blocking layer. The thickness design of u-GaN interlayer matching up with background doping level for improving laser performance is studied. It is found that a suitably chosen u-GaN interlayer can well modulate the optical absorption loss and optical confinement factor. However, if the value of background doping concentration of u-GaN interlayer is too large, the output light power may decrease. The analysis of energy band diagram of a LD structure with 100 nm u-GaN interlayer shows that the width of n-side depletion region decreases when the background concentration increases, and may become even too small to cover whole MQW, resulting in a serious decrease of the output light power. It means that a suitable interlayer thickness design matching with the background doping level of u-GaN interlayer is significant for InGaN-based laser diodes.
ISSN:2158-3226
2158-3226
DOI:10.1063/1.4945015