Identification of Soft Failure Mechanisms Triggered by ESD Stress on a Powered USB 3.0 Interface

The objective of this work is to identify electrostatic discharge (ESD) related soft failure mechanisms early in the product life cycle. We compare different methods of injecting ESD stress into USB 3.0 interfaces which are regularly exposed to ESD stress during end-user operation. A directional inj...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2019-02, Vol.61 (1), p.20-28
Main Authors: Koch, Sebastian, Orr, Benjamin J., Gossner, Harald, Gieser, Horst A., Maurer, Linus
Format: Article
Language:English
Subjects:
Data buses
Electrostatic discharge
Electrostatic discharges
failure analysis
Failure mechanisms
Failure modes
high-speed interconnects
IEC Standards
integrated circuit reliability
Life cycle engineering
Magnetic susceptibility
Magnetomechanical effects
Probes
Product life cycle
Static electricity
Stress
Stresses
Systems design
Universal Serial Bus
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Description
Summary:The objective of this work is to identify electrostatic discharge (ESD) related soft failure mechanisms early in the product life cycle. We compare different methods of injecting ESD stress into USB 3.0 interfaces which are regularly exposed to ESD stress during end-user operation. A directional injection method is applied which is compatible to high-speed line operation and capable to provide quantitative information about failure levels. Soft failure modes are investigated depending on the operational state of the system under test. Five typical categories of soft failure modes of a USB 3.0 interface could be identified. A method to use the characterization data gained from system verification boards for final system design is presented.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2018.2811645