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Coupled Electrical-Thermal-Mechanical Simulation for the Reliability Analysis of Large-Scale 3-D Interconnects

A multiphysics simulation technique based on the finite element method is developed for the reliability analysis of interconnects. The multiphysics simulation characterizes multidisciplinary, including electrical, thermal, and mechanical, aspects of interconnects. It is well known that the major bot...

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Published in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-02, Vol.7 (2), p.229-237
Main Authors:	Lu, Tianjian, Jin, Jian-Ming
Format:	Article
Language:	English
Subjects:	Bonding wire Computational efficiency Computational modeling Computer simulation Computing time domain decomposition Efficiency Finite element method finite element method (FEM) Integrated circuit interconnections Interconnections Mathematical analysis Mathematical model multiphysics modeling parallel computing Reliability Reliability analysis Simulation solder bump Strain Stress Thermal analysis Thermal simulation Thermal stress thermoelasticity
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container_title	IEEE transactions on components, packaging, and manufacturing technology (2011)
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creator	Lu, Tianjian Jin, Jian-Ming
description	A multiphysics simulation technique based on the finite element method is developed for the reliability analysis of interconnects. The multiphysics simulation characterizes multidisciplinary, including electrical, thermal, and mechanical, aspects of interconnects. It is well known that the major bottleneck preventing 3-D simulations from gaining further popularity is the computational efficiency in dealing with practically large-scale problems. To address this problem, the proposed multiphysics simulation is devised for analyzing large-scale problems with a significantly improved computational efficiency through utilizing a domain decomposition scheme called the finite element tearing and interconnecting, parallel computing, and the localized nature of thermal stresses in the interconnect structures. Both the capability and efficiency of the multiphysics simulation are demonstrated through analyzing large-scale interconnect structures including arrays of solder bumps and bonding wires. Detailed temperature distributions and localized stresses of large amplitude are obtained through the proposed simulation in a highly efficient manner.
doi_str_mv	10.1109/TCPMT.2016.2639359
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source	IEEE Electronic Library (IEL) Journals
subjects	Bonding wire Computational efficiency Computational modeling Computer simulation Computing time domain decomposition Efficiency Finite element method finite element method (FEM) Integrated circuit interconnections Interconnections Mathematical analysis Mathematical model multiphysics modeling parallel computing Reliability Reliability analysis Simulation solder bump Strain Stress Thermal analysis Thermal simulation Thermal stress thermoelasticity
title	Coupled Electrical-Thermal-Mechanical Simulation for the Reliability Analysis of Large-Scale 3-D Interconnects
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