Effect of Nanodiamond (ND) Surface Functionalization on the Properties of ND/PEEK Composites

This paper explores the effect of nanodiamond (ND) surface chemistry on the structure and properties of composites of ND melt-blended with poly(ether-ether-ketone) (PEEK). ND functionalized with phenylphosphonate (PPA) resulted in ND/PEEK composites with improved filler dispersion based on visual ob...

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Bibliographic Details
Published in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-02, Vol.7 (2), p.165-177
Main Authors: Wahab, Zahidul, Marsh, Zachary M., Tessema, Addis, Kidane, Addis, Stefik, Morgan, Anneaux, Bruce L., Ploehn, Harry J.
Format: Article
Language:English
Subjects:
Composite
Conductivity
Crystal structure
Crystallinity
Degree of crystallinity
Diamonds
dielectric permittivity
Dielectrics
electrical conductivity
Electrical resistivity
Heat conductivity
Heat transfer
Heating
High temperature
nanodiamond (ND)
Nanostructure
Organic chemistry
Permittivity
phenylphosphonate (PPA)
poly(ether-ether-ketone) (PEEK)
Polyether ether ketones
Polymer matrix composites
Surface topography
Temperature measurement
Thermal conductivity
Thermal stability
Visual observation
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Summary:This paper explores the effect of nanodiamond (ND) surface chemistry on the structure and properties of composites of ND melt-blended with poly(ether-ether-ketone) (PEEK). ND functionalized with phenylphosphonate (PPA) resulted in ND/PEEK composites with improved filler dispersion based on visual observations and surface topography measurements. As-received oxidized ND (OND) reduces PEEK's lamellar spacing and degree of crystallinity, as does PPA-modified carboxylated ND, which has low PPA graft density. PPA-modified OND does not significantly alter PEEK's crystalline structure or degree of crystallinity. Sonication during PPA grafting on OND increases composite thermal conductivity by up to 38% relative to pure PEEK. ND/PEEK composites have dielectric permittivity values comparable to and in some cases lower than pure PEEK and electrical conductivity values no greater than pure PEEK. The combination of enhanced thermal conductivity, low dielectric permittivity, and low electrical conductivity makes ND/PEEK composites attractive for high-temperature electronic device applications.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2016.2646671