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Laser ablation/ionization technique for trace element analysis
The laser ablation/ionization technique combined with a reflectron time-of-flight mass spectrometer was used to detect trace elements in industry-made semiconductor samples of silicon and GaAs.
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Published in: | Analytical chemistry (Washington) 1993-11, Vol.65 (22), p.3194-3198 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that cite this one |
Online Access: | Get full text |
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Summary: | The laser ablation/ionization technique combined with a reflectron time-of-flight mass spectrometer was used to detect trace elements in industry-made semiconductor samples of silicon and GaAs. |
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ISSN: | 0003-2700 1520-6882 |
DOI: | 10.1021/ac00070a005 |