Bisphenol-A bimodal epoxy resins. Part I: The dynamic mechanical characterization of a 6300 (340/22,500) weight average molecular weight system

By using an advanced epoxy resin of 22,500 weight average molecular weight two bimodal systems of 6300 weight average molecular weights were prepared. By altering the curing procedure normally used to cure epoxy resins and high molecular weight resins we have succeeded in minimizing the difficulty a...

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Bibliographic Details
Published in:Polymer engineering and science 1994-11, Vol.34 (21), p.1635-1642
Main Authors: Holmes, Gale A., Letton, Alan
Format: Article
Language:English
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Summary:By using an advanced epoxy resin of 22,500 weight average molecular weight two bimodal systems of 6300 weight average molecular weights were prepared. By altering the curing procedure normally used to cure epoxy resins and high molecular weight resins we have succeeded in minimizing the difficulty associated with preparing bimodal epoxy resin systems. The ultimate Tg of these bimodal systems is associated with the phase morphology and controlled by the curing conditions employed. For the completely phase separated bimodal system a Tg of 473 K is reported and for the partially phase separated system a Tg of 466 K is reported. Equations were developed for predicting the equilibrium shear modulus of these bimodal systems. Theoretical predictions based on these equations were found to be consistent with experimental results.
ISSN:0032-3888
1548-2634
DOI:10.1002/pen.760342109