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First Results on 3D Pixel Sensors Interconnected to the RD53A Readout Chip after Irradiation to $1\times$$10^{16}\(neq cm\)^{-2}

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}\(neq cm\)^{-2}$ (1MeV equivalent neutrons). All presented re...

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Published in:arXiv.org 2019-03
Main Authors: Meschini, M, Ceccarelli, R, Dinardo, M, Gennai, S, Moroni, L, Zuolo, D, Demaria, L, Monteil, E, Gaioni, L, Messineo, A, Curras, E, Duarte, J, Fernandez, M, Gomez, G, Garcia, A, Gonzalez, J, Silva, E, Vila, I, Dalla Betta, G F, Mendicino, R, Boscardin, M
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Language:English
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Summary:Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about $1\times$$10^{16}\(neq cm\)^{-2}$ (1MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC). A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.
ISSN:2331-8422
DOI:10.48550/arxiv.1903.01963