Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad

The choice of abrasive particle size is crucial to improve the lapping efficiency and surface quality in lapping of sapphire wafer by fixed abrasive (FA) pad. A model for the penetration depth of a single abrasive is developed with fixed abrasive pad. A serious of lapping tests were carried out usin...

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Published in:Key engineering materials 2018-02, Vol.764, p.106-114
Main Authors: Li, Zhen, Zhu, Yong Wei, Jiang, Ben Chi, Shi, Pei Cheng, Wang, Jian Bin
Format: Article
Language:English
Subjects:
Ceramics industry
Diamonds
Lapping (finishing)
Material removal rate (machining)
Particle size
Penetration depth
Sapphire
Surface properties
Surface roughness
Workpieces
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Zhu, Yong Wei
Jiang, Ben Chi
Shi, Pei Cheng
Wang, Jian Bin
description The choice of abrasive particle size is crucial to improve the lapping efficiency and surface quality in lapping of sapphire wafer by fixed abrasive (FA) pad. A model for the penetration depth of a single abrasive is developed with fixed abrasive pad. A serious of lapping tests were carried out using FA pads embedded with different size of diamond particles to verify the validity of the developed model. Results show that the penetration depth of abrasive is related not only to the particle size, but to the hardness ratio of the work-piece to the pad as well. The material removal rate of sapphire is proportional to the square of abrasive particle size, while the average surface roughness is proportional to the abrasive particle size.
doi_str_mv 10.4028/www.scientific.net/KEM.764.106
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subjects Ceramics industry
Diamonds
Lapping (finishing)
Material removal rate (machining)
Particle size
Penetration depth
Sapphire
Surface properties
Surface roughness
Workpieces
title Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
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