Molecular dynamics simulation of effects of nanoparticles on frictional heating and tribological properties at various temperatures

The temperature of a friction pair exerts considerable influence on the tribological behavior of a system. In two cases, one with and the other without Cu (copper) nanoparticles, the temperature increase in friction pairs caused by frictional heating and its tribological properties at various temper...

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Bibliographic Details
Published in:Friction 2020-06, Vol.8 (3), p.531-541
Main Authors: Hu, Chengzhi, Lv, Jizu, Bai, Minli, Zhang, Xiaoliang, Tang, Dawei
Format: Article
Language:English
Subjects:
Abrasion
Computer simulation
Copper
Corrosion and Coatings
Engineering
Friction
Heating
Mechanical Engineering
Mechanical properties
Molecular dynamics
Nanoparticles
Nanotechnology
Physical Chemistry
Research Article
Surfaces and Interfaces
Temperature
Temperature distribution
Temperature gradients
Thin Films
Tribology
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Summary:The temperature of a friction pair exerts considerable influence on the tribological behavior of a system. In two cases, one with and the other without Cu (copper) nanoparticles, the temperature increase in friction pairs caused by frictional heating and its tribological properties at various temperatures are studied by using the molecular dynamics approach. The results show that temperature distribution and surface abrasion are significantly improved by the presence of Cu nanoparticles. This is one of the reasons for the improvements in tribological properties achieved in the presence of nanoparticles. The temperature and range of influence of frictional heating for the model without nanoparticles are significantly increased with the increase in the sliding velocity; however, in the model with nanoparticles, the temperature gradient is confined to the area near the Cu film. With an increase in the temperature of the friction pair, the improvement in anti-wear properties associated with the presence of Cu nanoparticles becomes more significant.
ISSN:2223-7690
2223-7704
DOI:10.1007/s40544-019-0271-9