Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

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Bibliographic Details
Published in:IBM journal of research and development 1995-07, Vol.39 (4), p.465-497
Main Authors: Hu, C.-K., Rodbell, K. P., Sullivan, T. D., Lee, K. Y., Bouldin, D. P.
Format: Article
Language:English
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ISSN:0018-8646
0018-8646
2151-8556
DOI:10.1147/rd.394.0465