Studies on adhesion performance of addition-curable liquid silicone rubber on epoxy networks treated with different structures borosiloxane oligomers

In this investigation, 3-glycidoxypropyltrimethoxysilane and boric acid with the molar ratio of 1, 2, and 3 were used to synthesize different structures borosiloxane oligomers (BSiO-1, BSiO-2, and BSiO-3). The structures of these borosiloxane oligomers were evaluated by the gel permeation chromatogr...

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Bibliographic Details
Published in:Journal of adhesion science and technology 2019-04, Vol.33 (8), p.861-870
Main Authors: Zhao, Xiong-Wei, Zang, Chong-Guang, Wen, Yu-Quan, Jiao, Qing-Jie
Format: Article
Language:English
Subjects:
addition-curable liquid silicone rubber
Adhesion
Adhesion tests
Adhesive strength
Adhesives
Attenuation
borosiloxane oligomers
epoxy networks
Field emission microscopy
Fourier transforms
Infrared analysis
Liquid chromatography
NMR
Nuclear magnetic resonance
Oligomers
Pull out tests
Silicone rubber
Silicones
Spectrum analysis
structure
Thermogravimetric analysis
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Summary:In this investigation, 3-glycidoxypropyltrimethoxysilane and boric acid with the molar ratio of 1, 2, and 3 were used to synthesize different structures borosiloxane oligomers (BSiO-1, BSiO-2, and BSiO-3). The structures of these borosiloxane oligomers were evaluated by the gel permeation chromatography, the Fourier transform infrared spectroscopy, the nuclear magnetic resonance spectroscopy, and the thermogravimetric analysis. The influence of borosiloxane oligomers structures on adhesion between addition-curable liquid silicone rubber and epoxy networks was investigated by pull-out test. Results showed that BSiO-1 and BSiO-2 exhibited excellent adhesive property with the adhesion strength being increased from 0.02 to 0.18 MPa, whereas BSiO-3, with an adhesion strength value of 0.1 MPa, displayed a slightly inferior adhesive characteristic. Field emission scanning electronic microscopy revealed the attenuation of adhesive characteristic of BSiO-1, BSiO-2, and BSiO-3 in turn, and an adhesive attenuation mechanism was proposed.
ISSN:0169-4243
1568-5616
DOI:10.1080/01694243.2019.1567068