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Formation of Nanoporous Copper-Silicide Films

The possibility of forming nanoporous copper-silicide films with different phase compositions is experimentally demonstrated. For this purpose, the parameters of the initial a -Si/Cu structure and the conditions of its annealing are chosen so that the process of solid-phase synthesis comes to a halt...

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Bibliographic Details
Published in:Semiconductors (Woodbury, N.Y.) N.Y.), 2019-03, Vol.53 (3), p.395-399
Main Authors: Buchin, E. Yu, Naumov, V. V., Vasilyev, S. V.
Format: Article
Language:English
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Summary:The possibility of forming nanoporous copper-silicide films with different phase compositions is experimentally demonstrated. For this purpose, the parameters of the initial a -Si/Cu structure and the conditions of its annealing are chosen so that the process of solid-phase synthesis comes to a halt at the stage of formation of a branched silicide cluster. Then the films are subjected to liquid etching in a mixture of diluted inorganic acids. In this case, the metastable Cu x Si phase with a low Cu content is selectively removed, and a three-dimensional silicide cluster is released. At the same time, surface Kirkendall voids present in the films open. As a result of these two processes in combination, a nanoporous structure is formed.
ISSN:1063-7826
1090-6479
DOI:10.1134/S1063782619030059