Brass-texture induced grain structure evolution in room temperature rolled ODS copper

Currently, advanced ODS copper alloy is under study as a potential fusion material providing good mechanical properties. In this work, in order to develop a high performance ODS copper containing 0.5 wt% Y2O3 oxide particles, the effect of room temperature rolling and subsequent annealing on the gra...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2019-03, Vol.749, p.118-128
Main Authors: Aghamiri, S.M.S., Oono, N., Ukai, S., Kasada, R., Noto, H., Hishinuma, Y., Muroga, T.
Format: Article
Language:English
Subjects:
Ambient temperature
Brass texture
Copper
Copper base alloys
Crystal structure
Deformation mechanisms
Dislocation pinning
Dispersion hardening alloys
Evolution
Grain size distribution
Grain structure
Heat treating
High temperature
Mechanical properties
Microstructure
ODS copper
Particle size distribution
Recrystallization
Reduction
Rolling and recrystallization
Room temperature
Single crystals
Tensile properties
Tensile tests
Texture
Yttrium oxide
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Summary:Currently, advanced ODS copper alloy is under study as a potential fusion material providing good mechanical properties. In this work, in order to develop a high performance ODS copper containing 0.5 wt% Y2O3 oxide particles, the effect of room temperature rolling and subsequent annealing on the grain structure evolution, texture development and tensile properties are studied using EBSD, TEM and tensile tests. Microstructure evolution studies show the grain structure coarsens by enhancing the Brass texture during increase of rolling reduction and a unique single crystal-like brass-texture deformed structure is achieved after 80% rolling reduction. We found the deformation mechanism of partial slip by a6〈211〉 dislocations facilitated by the pinning of a2〈101〉 perfect dislocations through fine oxide particles is responsible for formation of Brass texture during room temperature rolling. Furthermore, the recrystallization of ODS copper retards to high temperature of ~700 °C and shows a fine-grained microstructure with different orientations of Goss, Brass, S and Copper. Evaluation of microstructure-mechanical properties of the recrystallized samples expresses that the bimodal grain size distribution at 800 °C for 30 min offers a good tensile strength-ductility (UTS: 491 MPa, elt: 19%) at ambient temperature.
ISSN:0921-5093
1873-4936
DOI:10.1016/j.msea.2019.02.019