Low-Temperature Curable Dielectric Materials with Higher Reliability

Semiconductor packages with redistribution layers have been necessary with their miniaturization and functionalization. Dielectric materials for the packages require low-temperature curability to avoid thermal damage of devices and thermally unstable materials in the packages, and to keep high relia...

Full description

Saved in:
Bibliographic Details
Published in:Journal of photopolymer science and technology 2018-09, Vol.31 (5), p.625
Main Authors: Komine, Takuya, Tanimoto, Akitoshi, Aoki, Yu, Kimura, Mika, Hamano, Yoshimi, Sasaki, Mamoru
Format: Article
Language:eng ; jpn
Subjects:
Dielectrics
Low temperature
Mechanical properties
Miniaturization
Packages
Photosensitivity
Reliability analysis
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Semiconductor packages with redistribution layers have been necessary with their miniaturization and functionalization. Dielectric materials for the packages require low-temperature curability to avoid thermal damage of devices and thermally unstable materials in the packages, and to keep high reliability for various thermal tests. Low-temperature curable positive-tone photosensitive material AR-5100 was developed and its reliabilities were evaluated. AR-5100 kept mechanical properties after reliability tests. Especially, AR-5100 had good bias HAST tolerance. AR-5100 is capable of adapting to next-generation packages which require high reliability.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.31.625