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Analysis of Resist Removal Phenomenon Using Laser Irradiation

Resist removal phenomenon with laser irradiation was analyzed by using a finite element (FE) method. Laser irradiation in the water can improve the resist removal effect as compared with that of normal atmosphere irradiation. A two-dimensional (2-D) micro-FE model was constructed based on the bounda...

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Bibliographic Details
Published in:Journal of Photopolymer Science and Technology 2017/06/26, Vol.30(3), pp.291-295
Main Authors: Kamimura, Tomosumi, Kuramae, Hirouki, Yamashiro, Takayuki, Nuno, Kosuke, Umeda, Yuji, Tsujimoto, Singo, Nakamura, Ryosuke, Nishiyama, Takashi, Horibe, Hideo
Format: Article
Language:English
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Summary:Resist removal phenomenon with laser irradiation was analyzed by using a finite element (FE) method. Laser irradiation in the water can improve the resist removal effect as compared with that of normal atmosphere irradiation. A two-dimensional (2-D) micro-FE model was constructed based on the boundary surface between the Si wafer, resist and water during laser radiation. In the normal atmosphere, any effective stress did not occur along the x-axis direction in the resist. In contrast, for the laser irradiation in the water, large compressive stress was confirmed along the x-axis direction in the resist. This compressive stress in the resist is thought to improve the resist removal efficiency.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.30.291