The pressureless sintering of micron silver paste for electrical connections

In this paper, we explore the pressureless sintering of spherical micron silver paste for electrical connections. The micron silver paste was sintered under different temperature in the range of 200–300 °C in air. The experimental results show that the density, shear strength, area ratio of fracture...

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Bibliographic Details
Published in:Journal of alloys and compounds 2019-07, Vol.795, p.163-167
Main Authors: Zhang, Weifeng, Chen, Jian, Deng, Zhonghua, Liu, Zhuguang, Huang, Qiufeng, Guo, Wang, Huang, Jiquan
Format: Article
Language:English
Subjects:
Bonding strength
Conductivity
Electric properties
Fracture surfaces
Loose powder sintering
Pressureless sintering
Shear strength
Silver
Sintering
Spherical micron Ag
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Summary:In this paper, we explore the pressureless sintering of spherical micron silver paste for electrical connections. The micron silver paste was sintered under different temperature in the range of 200–300 °C in air. The experimental results show that the density, shear strength, area ratio of fracture surface, and thermal/electric properties of sintered Ag joint increased with increasing temperature. The sample sintered at 280 °C have strong bonding strength, and excellent electrical/thermal performance (comparable with nano silver and even higher than Sn paste). Our protocol will provide beneficial reference for the application of sintering micron Ag paste in electrical connections. •The pressureless sintering of spherical micron silver paste was explored.•The morphology of silver joint depended greatly on the temperature.•The property of sample is comparable with nano silver and higher than Sn paste.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2019.04.270