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Scale-invariant avalanche dynamics in the temperature-driven martensitic transition of a Cu-Al-Be single crystal
We have combined high sensitivity, extra-low differential temperature scanning rate calorimetry, and acoustic emission (AE) measurements to study avalanches during the cubic ↔ 18R martensitic transition of a Cu-Al-Be single crystalline shape memory alloy. Both AE and calorimetry corroborate a good p...
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Published in: | Physical review. B 2019-06, Vol.99 (22), p.1, Article 224101 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | We have combined high sensitivity, extra-low differential temperature scanning rate calorimetry, and acoustic emission (AE) measurements to study avalanches during the cubic ↔ 18R martensitic transition of a Cu-Al-Be single crystalline shape memory alloy. Both AE and calorimetry corroborate a good power-law behavior for cooling with an exponent ɛ≃1.6. For heating, a slope is observed in the maximum likelihood curves, which confirms that our data are affected by an exponential cutoff. An effective energy exponent, ɛ∼1.85, and a cutoff, λ−1=0.115(38)×10−3aJ, were determined by fits of power-laws with exponential damping. The long tail observed in the low-temperature region by calorimetric measurements suggests the existence of significant elastic effects that constrain the progress of the transformation at low temperatures. While thermodynamic features such as transformation enthalpy and entropy are those expected for Cu-based shape-memory alloys undergoing a cubic ↔ 18R transition, the critical behavior deviates from the corresponding behavior expected from this symmetry change. These deviations are a consequence of the elastic hardening induced by the interplay of the transformation with dislocation jamming, which has the effect of effectively reducing the number of pathways connecting the parent and martensitic phase. |
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ISSN: | 2469-9950 2469-9969 |
DOI: | 10.1103/PhysRevB.99.224101 |