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The key factor for fabricating through-hole TiO2 nanotube arrays: a fluoride-rich layer between Ti substrate and nanotubes
Through-hole TiO 2 nanotube arrays (THTNA) are fabricated successfully by applying a large-voltage pulse (Δ V ≥ 40 V) at the end of anodization, and a mechanism is proposed that the fluoride-rich layer (FRL) between Ti substrate and nanotubes is the key factor for fabricating THTNA. In order to con...
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Published in: | Journal of materials science 2014-10, Vol.49 (19), p.6742-6749 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Through-hole TiO
2
nanotube arrays (THTNA) are fabricated successfully by applying a large-voltage pulse (Δ
V
≥ 40 V) at the end of anodization, and a mechanism is proposed that the fluoride-rich layer (FRL) between Ti substrate and nanotubes is the key factor for fabricating THTNA. In order to confirm the mechanism, the effects of temperature of voltage pulse on the morphology of the bottom of TiO
2
nanotubes are explored. The results show the inner diameter of the bottom became larger with the temperature increasing due to the wall thickness of bottom of TiO
2
nanotubes decreased and assisted by the increased fluorine content of the bottom, which is strong evidence for the mechanism proposed. What is more, the inner diameter of the bottom of THTNA can be manipulated via this novel mechanism. |
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ISSN: | 0022-2461 1573-4803 |
DOI: | 10.1007/s10853-014-8368-z |