Creep deformation behavior of Sn–Zn solder alloys

Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep...

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Bibliographic Details
Published in:Journal of materials science 2014-03, Vol.49 (5), p.2127-2135
Main Authors: Shrestha, Triratna, Gollapudi, Srikant, Charit, Indrajit, Murty, K. Linga
Format: Article
Language:English
Subjects:
Alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Classical Mechanics
Creep strength
Crystallography and Scattering Methods
Deformation mechanisms
Degassing of metals
Dislocations
Electron microscopes
Impression creep
Materials Science
Metals
Polymer Sciences
Solid Mechanics
Specialty metals industry
Temperature
Tin base alloys
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Summary:Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50–75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.
ISSN:0022-2461
1573-4803
DOI:10.1007/s10853-013-7905-5