Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly

A passive self-alignment and assembly approach for optical fibers is proposed and demonstrated using a combination of silicon micromachining and 3D printing to achieve efficient and accurate near-vertical coupling to a silicon-on-insulator (SOI) substrate with monolithic ridge waveguides and grating...

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Bibliographic Details
Published in:IEEE photonics technology letters 2019-08, Vol.31 (16), p.1311-1314
Main Authors: Wan, Congshan, Gonzalez, Joe L., Fan, Tianren, Adibi, Ali, Gaylord, Thomas K., Bakir, Muhannad S.
Format: Article
Language:English
Subjects:
Assembly
Couplers
fiber array
fiber coupling
Gratings
Micromachining
optical alignment
Optical fiber
Optical fibers
Optical waveguides
passive alignment
Photonics
Resists
Self alignment
Silicon
Silicon substrates
Substrates
Three dimensional printing
Waveguides
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Summary:A passive self-alignment and assembly approach for optical fibers is proposed and demonstrated using a combination of silicon micromachining and 3D printing to achieve efficient and accurate near-vertical coupling to a silicon-on-insulator (SOI) substrate with monolithic ridge waveguides and grating couplers. The alignment process is repeatable and the peak efficiency is comparable to the active fiber alignment efficiency (86% or −0.67 dB of that obtained from active alignment). The overall alignment accuracy is in the submicron range due to the formation of mechanical self-aligning structures. The overall approach is compatible with numerous applications, including fiber-to-chip and fiber-to-package assemblies as well as in the testing of photonic devices.
ISSN:1041-1135
1941-0174
DOI:10.1109/LPT.2019.2923206