A High-Sensitivity Resonant Tangential E-Probe With Loaded Improved Dipole and Embedded Integrated Balun

• Published in: IEEE transactions on instrumentation and measurement 2019-08, Vol.68 (8), p.3042-3044
• Main Authors: Wang, Jianwei, Yan, Zhaowen, Liu, Wei, Su, Donglin, Yan, Xin, Fan, Jun
• Format: Article
• Language: English
• Subjects: Baluns; Broadband; Broadband communication; Dipoles; E-field probe; electromagnetic compatibility (EMC); Field strength; high sensitivity; Impedance; Marchand balun; Microstrip; Microstrip transmission lines; noise-equivalent field strength (NEFS); Probes; resonant tangential; Sensitivity; Sensitivity enhancement; Short circuits; Transmission line measurements
• ISSN: 0018-9456; 1557-9662
• DOI: 10.1109/TIM.2019.2920700

In this paper, a high-sensitivity resonant probe for capturing tangential E -field component is fabricated on a four-layer printed circuit board. The resonant probe consists of an improved dipole employed to further enhance sensitivity, a resonator made up of open- and short-circuit stubs achieving specific resonance, and an integrated Marchand balun used to transform the differential-mode voltage to the single-end output and match the instrument port impedance match. Compared with the referenced broadband probe, the relative sensitivity of the proposed resonant probe in terms of \vert S_{12}\vert is enhanced by 13.21 and 14.82 dB for simulation and measurement, respectively. The absolute sensitivity in terms of the noise-equivalent field strength (NEFS) is 26.4 {\mathrm{ dB}} \mu {\mathrm{ V}} ({\mathrm{ Hz}})^{1/2} . The measurements of the passive circuits (microstrip lines and coupled lines) and active circuit module are conducted to validate the resonant probe.