Influence of dielectric and machining parameters on the process performance for electric discharge milling of SiC ceramic

Silicon carbide (SiC) ceramic has been widely used in modern industry because of its superior mechanical properties, wear, and corrosion resistance even at elevated temperature. However, the manufacture of SiC ceramic is not an efficient process by conventional machining methods. This paper employs...

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Bibliographic Details
Published in:International journal of advanced manufacturing technology 2012-03, Vol.59 (1-4), p.127-136
Main Authors: Ji, Renjie, Liu, Yonghong, Zhang, Yanzhen, Cai, Baoping, Ma, Jianmin, Li, Xiaopeng
Format: Article
Language:English
Subjects:
CAE) and Design
Ceramic tools
Ceramics industry
Computer-Aided Engineering (CAD
Corrosion resistance
Corrosive wear
Dielectrics
Electric discharges
Engineering
High temperature
Industrial and Production Engineering
Material removal rate (machining)
Mechanical Engineering
Mechanical properties
Media Management
Milling (machining)
Original Article
Polarity
Process parameters
Process planning
Pulse duration
Silicon carbide
Surface roughness
Wear resistance
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Summary:Silicon carbide (SiC) ceramic has been widely used in modern industry because of its superior mechanical properties, wear, and corrosion resistance even at elevated temperature. However, the manufacture of SiC ceramic is not an efficient process by conventional machining methods. This paper employs a steel-toothed wheel as the tool electrode to machine SiC ceramic using electric discharge milling. The process is able to effectively machine a large surface area on SiC ceramic. To further improve the process performance, three kinds of emulsion are proposed as the dielectric in this paper. The effects of dielectric, tool polarity, pulse duration, pulse interval, peak voltage, and peak current on the process performance such as the material removal rate (MRR) and surface roughness (SR) have been investigated. Furthermore, the microstructure of the machined surface is examined with a scanning electron microscope (SEM), an energy-dispersive spectrometer (EDS), and X-ray diffraction (XRD).
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-011-3493-1