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Optimization of multi-response processes using the VIKOR method

Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However, these methods were developed to optimize single-response processes. In many situations, multiple responses must be optimized simultaneously, since some product designs,...

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Bibliographic Details
Published in:International journal of advanced manufacturing technology 2007-02, Vol.31 (11-12), p.1049-1057
Main Authors: Tong, Lee-Ing, Chen, Chi-Chan, Wang, Chung-Ho
Format: Article
Language:English
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Summary:Design of experiments and Taguchi methods are extensively adopted as off-line quality improvement techniques in industry. However, these methods were developed to optimize single-response processes. In many situations, multiple responses must be optimized simultaneously, since some product designs, especially in the integrated circuit industry, are becoming increasingly complex to meet customers’ demands. Although several procedures for optimizing multi-response processes have been developed in recent years, the associated quality measurement indices do not consider variations in the relative quality losses of multiple responses. These procedures may therefore result in an optimization in which quality losses associated with a few responses are very small but those associated with others are very large, even if the overall average quality loss is small. Such an optimization with a large variation of quality losses among the responses is usually unacceptable to engineers. Accordingly, this study employs the VIKOR method, which is a compromise ranking method used for multicriteria decision making (MCDM), to optimize the multi-response process. The proposed method considers both the mean and the variation of quality losses associated with several multiple responses, and ensures a small variation in quality losses among the responses, along with a small overall average loss. Two case studies of plasma-enhanced chemical vapor deposition and copper chemical mechanical polishing demonstrate the effectiveness of the proposed method.
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-005-0284-6