Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Acceleration factors and predictive life models are of use to build-in board assembly reliability and estimate solder joint life at the design stage. They allow designers to answer management and end-users’ reliability questions. This paper reviews the grand families of solder joint reliability mode...

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Bibliographic Details
Published in:JOM (1989) 2019, Vol.71 (1), p.143-157
Main Authors: Clech, Jean-Paul M., Coyle, Richard J., Arfaei, Babak
Format: Article
Language:English
Subjects:
Acceleration
Advances in Electronic Interconnection Materials
Assembly
Chemistry/Food Science
Crack initiation
Crack propagation
Design
Designers
Earth Sciences
Engineering
Environment
Failure
Failure mechanisms
International conferences
Lead free
Life prediction
Physics
Questions
Reliability
Reliability analysis
Shear strain
Soldered joints
Solders
Temperature
Thermal cycling
Tin
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Summary:Acceleration factors and predictive life models are of use to build-in board assembly reliability and estimate solder joint life at the design stage. They allow designers to answer management and end-users’ reliability questions. This paper reviews the grand families of solder joint reliability models that can help answer these types of questions. Different categories of models were reviewed, examples were provided and model limitations were discussed. Emphasis is on engineering models for Sn-Pb and Pb-free assemblies. Differences in the microstructure and failure mechanisms of near-eutectic Sn-Ag-Cu solders versus Sn-Pb are also reviewed, as they present new challenges to the development of thermo-mechanical models for surface mount assembly reliability assurance.
ISSN:1047-4838
1543-1851
DOI:10.1007/s11837-018-3003-0