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Thin Film Encapsulation of Organic Solar Cells by Direct Deposition of Polysilazanes from Solution
Organic electronic devices (OEDs), e.g., organic solar cells, degrade quickly in the presence of ambient gases, such as water vapor and oxygen. Thus, in order to extend the lifetime of flexible OEDs, they have to be protected by encapsulation. A solution‐based encapsulation method is developed, whic...
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Published in: | Advanced energy materials 2019-07, Vol.9 (26), p.n/a |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Organic electronic devices (OEDs), e.g., organic solar cells, degrade quickly in the presence of ambient gases, such as water vapor and oxygen. Thus, in order to extend the lifetime of flexible OEDs, they have to be protected by encapsulation. A solution‐based encapsulation method is developed, which allows the direct deposition of the diffusion barrier on top of OEDs, thus avoiding lamination of barrier films. The method is based on the deposition of a perhydropolysilazane (PHPS) ink and its subsequent conversion into a silica layer by deep UV irradiation. The resulting barrier films show water vapor transmission rates (WVTRs) of |
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ISSN: | 1614-6832 1614-6840 |
DOI: | 10.1002/aenm.201900598 |