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Low temperature and fast growth of one-directionally grown aluminum nitride film by atmospheric pressure halide CVD method
Aluminum Nitride (AlN) shows high thermal conductivity, high electrical resistivity, and chemical stability and expected as a candidate for a substrate of AlxGa1−xN based thin films for LEDs. In the present study, we demonstrate low temperature (800°C) and fast growth (9.2 µm/h) of one-directionally...
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Published in: | Journal of the Ceramic Society of Japan 2019/09/01, Vol.127(9), pp.612-616 |
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container_end_page | 616 |
container_issue | 9 |
container_start_page | 612 |
container_title | Journal of the Ceramic Society of Japan |
container_volume | 127 |
creator | SAKAMOTO, Naonori SUZUKI, Takaya KAWAGUCHI, Takahiko WAKIYA, Naoki SUZUKI, Hisao |
description | Aluminum Nitride (AlN) shows high thermal conductivity, high electrical resistivity, and chemical stability and expected as a candidate for a substrate of AlxGa1−xN based thin films for LEDs. In the present study, we demonstrate low temperature (800°C) and fast growth (9.2 µm/h) of one-directionally grown AlN film by atmospheric pressure halide CVD method, in which AlN films grow under air pressure without any requirement of vacuum systems. For obtaining uniaxial AlN films, seeding layer prepared at the initial stage of the growth plays an important role. Growth mechanisms and effects of the seeding layer is discussed based upon optical and miscrostructural analyses. |
doi_str_mv | 10.2109/jcersj2.19038 |
format | article |
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In the present study, we demonstrate low temperature (800°C) and fast growth (9.2 µm/h) of one-directionally grown AlN film by atmospheric pressure halide CVD method, in which AlN films grow under air pressure without any requirement of vacuum systems. For obtaining uniaxial AlN films, seeding layer prepared at the initial stage of the growth plays an important role. 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Ceram. Soc. Japan</addtitle><description>Aluminum Nitride (AlN) shows high thermal conductivity, high electrical resistivity, and chemical stability and expected as a candidate for a substrate of AlxGa1−xN based thin films for LEDs. In the present study, we demonstrate low temperature (800°C) and fast growth (9.2 µm/h) of one-directionally grown AlN film by atmospheric pressure halide CVD method, in which AlN films grow under air pressure without any requirement of vacuum systems. For obtaining uniaxial AlN films, seeding layer prepared at the initial stage of the growth plays an important role. Growth mechanisms and effects of the seeding layer is discussed based upon optical and miscrostructural analyses.</description><subject>Aluminum</subject><subject>Aluminum nitride</subject><subject>Atmospheric pressure</subject><subject>Chemical vapor deposition</subject><subject>CVD</subject><subject>Electrical resistivity</subject><subject>Low energy cost process</subject><subject>Low temperature</subject><subject>Nucleation</subject><subject>Organic chemistry</subject><subject>Substrates</subject><subject>Thermal conductivity</subject><subject>Thin film</subject><subject>Thin films</subject><subject>Vacuum systems</subject><issn>1882-0743</issn><issn>1348-6535</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNpF0E1r3DAQBmBTWmia9Ni7oGen-rAs-Vg2SVtYyCXkKsbyKJaxLVeSCZtfH-9uSC4awTwzMG9R_GD0mjPa_BosxjTwa9ZQoT8VF0xUuqylkJ-3v9a8pKoSX4tvKQ2U1rwS-qJ42YdnknFaMEJeIxKYO-IgZfIUw3PuSXAkzFh2PqLNPswwjodTbyYwrpOf14nMPkffIXF-nEh7IJCnkJYeo7dkiZjScXEP49HsHm_IhLkP3VXxxcGY8PtbvSwe7m4fdn_L_f2ff7vf-9JKpXLZYadZ3dbCCqt0JWXFZVtzZA2Aq1xDu7bplNJMMieAS5CtdI2GGjelUVwWP89rlxj-r5iyGcIatzuS4VwrWilesU2VZ2VjSCmiM0v0E8SDYdQc0zVv6ZpTupu_PfshZXjCdw0xezvih-bKNKf3NPfetz1Eg7N4BWZ-iZ0</recordid><startdate>20190901</startdate><enddate>20190901</enddate><creator>SAKAMOTO, Naonori</creator><creator>SUZUKI, Takaya</creator><creator>KAWAGUCHI, Takahiko</creator><creator>WAKIYA, Naoki</creator><creator>SUZUKI, Hisao</creator><general>The Ceramic Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20190901</creationdate><title>Low temperature and fast growth of one-directionally grown aluminum nitride film by atmospheric pressure halide CVD method</title><author>SAKAMOTO, Naonori ; SUZUKI, Takaya ; KAWAGUCHI, Takahiko ; WAKIYA, Naoki ; SUZUKI, Hisao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c577t-ded816b63c3c78455425b62e19aaf4f90db9d778151f3a25a5b5f98a6eb628e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Aluminum</topic><topic>Aluminum nitride</topic><topic>Atmospheric pressure</topic><topic>Chemical vapor deposition</topic><topic>CVD</topic><topic>Electrical resistivity</topic><topic>Low energy cost process</topic><topic>Low temperature</topic><topic>Nucleation</topic><topic>Organic chemistry</topic><topic>Substrates</topic><topic>Thermal conductivity</topic><topic>Thin film</topic><topic>Thin films</topic><topic>Vacuum systems</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>SAKAMOTO, Naonori</creatorcontrib><creatorcontrib>SUZUKI, Takaya</creatorcontrib><creatorcontrib>KAWAGUCHI, Takahiko</creatorcontrib><creatorcontrib>WAKIYA, Naoki</creatorcontrib><creatorcontrib>SUZUKI, Hisao</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of the Ceramic Society of Japan</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SAKAMOTO, Naonori</au><au>SUZUKI, Takaya</au><au>KAWAGUCHI, Takahiko</au><au>WAKIYA, Naoki</au><au>SUZUKI, Hisao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low temperature and fast growth of one-directionally grown aluminum nitride film by atmospheric pressure halide CVD method</atitle><jtitle>Journal of the Ceramic Society of Japan</jtitle><addtitle>J. Ceram. Soc. Japan</addtitle><date>2019-09-01</date><risdate>2019</risdate><volume>127</volume><issue>9</issue><spage>612</spage><epage>616</epage><pages>612-616</pages><issn>1882-0743</issn><eissn>1348-6535</eissn><abstract>Aluminum Nitride (AlN) shows high thermal conductivity, high electrical resistivity, and chemical stability and expected as a candidate for a substrate of AlxGa1−xN based thin films for LEDs. In the present study, we demonstrate low temperature (800°C) and fast growth (9.2 µm/h) of one-directionally grown AlN film by atmospheric pressure halide CVD method, in which AlN films grow under air pressure without any requirement of vacuum systems. For obtaining uniaxial AlN films, seeding layer prepared at the initial stage of the growth plays an important role. 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language | eng |
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source | J-STAGE (Japan Science & Technology Information Aggregator, Electronic) - Open Access English articles |
subjects | Aluminum Aluminum nitride Atmospheric pressure Chemical vapor deposition CVD Electrical resistivity Low energy cost process Low temperature Nucleation Organic chemistry Substrates Thermal conductivity Thin film Thin films Vacuum systems |
title | Low temperature and fast growth of one-directionally grown aluminum nitride film by atmospheric pressure halide CVD method |
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