Interconnect-shingling: Maximizing the active module area with conventional module processes

We present a module fabrication process enabling gap-free interconnection of c-Si solar cells using solder-based interconnection technology with ribbons or wires. The interconnect-shingling process increases the module efficiency by avoiding the gaps between the solar cells. The process is applicabl...

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Bibliographic Details
Published in:Solar energy materials and solar cells 2019-09, Vol.200, p.109991, Article 109991
Main Authors: Schulte-Huxel, Henning, Blankemeyer, Susanne, Morlier, Arnaud, Brendel, Rolf, Köntges, Marc
Format: Article
Language:English
Subjects:
Apertures
Cell adhesion
Encapsulation
Fabrication
High efficiency PV modules
Interconnect
Laminates
Lamination
Low pressure
Metallizing
Module integration
Modules
Photovoltaic cells
Ribbons
Shingled interconnection
Silver
Solar cell interconnection
Solar cells
Tapes (metallic)
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Summary:We present a module fabrication process enabling gap-free interconnection of c-Si solar cells using solder-based interconnection technology with ribbons or wires. The interconnect-shingling process increases the module efficiency by avoiding the gaps between the solar cells. The process is applicable to bifacial cells and uses well-proven interconnection technologies. In contrast to previous adhesive-based shingled modules, the current transport is supported by interconnects, thus reducing the silver consumption for the cells’ metallization and avoiding cell overlap. We lay down the cells on structured encapsulant layers to reduce mechanical stress at the cell edges during lamination. Alternatively, the lamination process can be adapted to allow the encapsulant to reflow. This also results in a low pressure at sensitive cell parts. Both approaches avoid crack formation. We demonstrate the interconnect-shingling process with a proof-of-concept module having a aperture area efficiency of 22.1%. Applying 200 thermal cycles does not cause any crack formation. •Process for gap-free solar cell interconnection with interconnect ribbons or wires.•Structured encapsulants or adapted lamination processes enable crack-free modules.•No crack formation after 200 thermal cycles.•Module with 22.1% efficiency manufactured with bifacial solar cells.
ISSN:0927-0248
1879-3398
DOI:10.1016/j.solmat.2019.109991