Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field

In the present study, for the first time, rotating magnetic field (RMF) was used to improve the solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu (SAC205) solder alloy. Results revealed that the microstructure and tensile behaviour were improved. As observed, after applying R...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2019-10, Vol.30 (20), p.18838-18847
Main Authors: Hammad, A. E., Ragab, M.
Format: Article
Language:English
Subjects:
Alloys
Characterization and Evaluation of Materials
Chemistry and Materials Science
Electronic packaging
Grain size
Magnetic fields
Materials Science
Mechanical properties
Microstructure
Optical and Electronic Materials
Solidification
Strain rate
Tensile tests
Tin base alloys
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Summary:In the present study, for the first time, rotating magnetic field (RMF) was used to improve the solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu (SAC205) solder alloy. Results revealed that the microstructure and tensile behaviour were improved. As observed, after applying RMF, grain size of β-Sn reduced to be ~ 10 μm which was decreased by ~ 60%. As well, an average size of IMCs formed in SAC205-B alloy were ~ 10–30 μm which were reduced by ~ 40–66%. Therefore, the growth rate of IMCs has been successfully suppressed with RMF. Interestingly, a decrease in grain size and IMCs thickness indicated the beneficial effect of applying RMF on the solder alloy. Consequently, in terms of tensile tests, SAC205 with RMF showed the highest strength over the entire temperatures and strain rates range. Moreover, UTS, YS, YM and El. % at room temperature (25 °C) of SAC205 alloy with RMF were ~ 9.0%, ~ 26.0%, ~ 8.0% and ~ 9.0% greater than that of RMF-free SAC205 alloy. Also, results showed that tensile strength of SAC205 alloy with and without RMF are remarkably sensitive to changes in both temperature and strain rate. Furthermore, the average stress exponent (n) and activation energy (Q) for RMF-free SAC205 and SAC205 with RMF solder alloys have been discussed. The obtained results should prove beneficial in the microelectronic packaging industry.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-019-02240-w