Loading…
Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018
Performance improvement by simple device scaling is running out of steam. Design and Technology Co-Optimization (DTCO) and System and Technology Co-Optimization (STCO) are the hot topics to overcome scaling issues by collaboration among device, circuit, and system communities. Another approach is se...
Saved in:
Published in: | IEEE journal of the Electron Devices Society 2018, Vol.6, p.1197-1199 |
---|---|
Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | |
---|---|
cites | |
container_end_page | 1199 |
container_issue | |
container_start_page | 1197 |
container_title | IEEE journal of the Electron Devices Society |
container_volume | 6 |
creator | Ishimaru, Kazunari Horiguchi, Naoto Nojiri, Kazuo Zhang, Paul Lining Berger, Paul R. |
description | Performance improvement by simple device scaling is running out of steam. Design and Technology Co-Optimization (DTCO) and System and Technology Co-Optimization (STCO) are the hot topics to overcome scaling issues by collaboration among device, circuit, and system communities. Another approach is seeking device innovation from manufacturing side with material and process communities. |
doi_str_mv | 10.1109/JEDS.2018.2884554 |
format | article |
fullrecord | <record><control><sourceid>proquest_ieee_</sourceid><recordid>TN_cdi_proquest_journals_2298374646</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>8576496</ieee_id><doaj_id>oai_doaj_org_article_eadae17b9c9c4038a7d9f2288198a2d6</doaj_id><sourcerecordid>2298374646</sourcerecordid><originalsourceid>FETCH-LOGICAL-c354t-578a1826c694a7ffcbbfc35f3d5f0b7adc471734695051818241d964ca80c313</originalsourceid><addsrcrecordid>eNpNUU1LAzEQXURBUX-AeAl40UNrspvNx1Ha9QvFg72HaTKpKeumZreC_96sFTEEJpl58zJ5ryjOGJ0yRvX1YzN_nZaUqWmpFK9rvlcclUyoiZAV3_93PixO-35N81JMaCGOinS3xX4gjQtDTAFa8rpB-xPRDiF2JO_hDcdr7Bxp2pxOOTfHz2CxJwu0b11s4-qLQK4_Q7f1YIdtCt2KXDbzxfMVmcXOY8LOIhmHPCkOPLQ9nv7G42Jx2yxm95Onl7uH2c3TxFY1Hya1VMBUKazQHKT3drn0ueIrV3u6lOAslyz_Seia1kxlKGdOC25BUVux6rh42NG6CGuzSeEd0peJEMxPIqaVgTQE26JBcIBMLrXVltNKgXTal1lLphWUTmSuix3XJsWPUTCzjtvU5elNWWpVSS74iGI7lE2x7xP6v1cZNaNRZjTKjBqYX6Nyz_muJyDiH17VUnAtqm-Qd40D</addsrcrecordid><sourcetype>Open Website</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2298374646</pqid></control><display><type>article</type><title>Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018</title><source>IEEE Xplore Open Access Journals</source><creator>Ishimaru, Kazunari ; Horiguchi, Naoto ; Nojiri, Kazuo ; Zhang, Paul Lining ; Berger, Paul R.</creator><creatorcontrib>Ishimaru, Kazunari ; Horiguchi, Naoto ; Nojiri, Kazuo ; Zhang, Paul Lining ; Berger, Paul R.</creatorcontrib><description>Performance improvement by simple device scaling is running out of steam. Design and Technology Co-Optimization (DTCO) and System and Technology Co-Optimization (STCO) are the hot topics to overcome scaling issues by collaboration among device, circuit, and system communities. Another approach is seeking device innovation from manufacturing side with material and process communities.</description><identifier>ISSN: 2168-6734</identifier><identifier>EISSN: 2168-6734</identifier><identifier>DOI: 10.1109/JEDS.2018.2884554</identifier><identifier>CODEN: IJEDAC</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Circuits ; Communities ; Design engineering ; Design optimization ; Electron devices ; Meetings ; Optimization ; Special issues and sections</subject><ispartof>IEEE journal of the Electron Devices Society, 2018, Vol.6, p.1197-1199</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2018</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8576496$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>314,780,784,4024,27633,27923,27924,27925,54933</link.rule.ids></links><search><creatorcontrib>Ishimaru, Kazunari</creatorcontrib><creatorcontrib>Horiguchi, Naoto</creatorcontrib><creatorcontrib>Nojiri, Kazuo</creatorcontrib><creatorcontrib>Zhang, Paul Lining</creatorcontrib><creatorcontrib>Berger, Paul R.</creatorcontrib><title>Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018</title><title>IEEE journal of the Electron Devices Society</title><addtitle>JEDS</addtitle><description>Performance improvement by simple device scaling is running out of steam. Design and Technology Co-Optimization (DTCO) and System and Technology Co-Optimization (STCO) are the hot topics to overcome scaling issues by collaboration among device, circuit, and system communities. Another approach is seeking device innovation from manufacturing side with material and process communities.</description><subject>Circuits</subject><subject>Communities</subject><subject>Design engineering</subject><subject>Design optimization</subject><subject>Electron devices</subject><subject>Meetings</subject><subject>Optimization</subject><subject>Special issues and sections</subject><issn>2168-6734</issn><issn>2168-6734</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>DOA</sourceid><recordid>eNpNUU1LAzEQXURBUX-AeAl40UNrspvNx1Ha9QvFg72HaTKpKeumZreC_96sFTEEJpl58zJ5ryjOGJ0yRvX1YzN_nZaUqWmpFK9rvlcclUyoiZAV3_93PixO-35N81JMaCGOinS3xX4gjQtDTAFa8rpB-xPRDiF2JO_hDcdr7Bxp2pxOOTfHz2CxJwu0b11s4-qLQK4_Q7f1YIdtCt2KXDbzxfMVmcXOY8LOIhmHPCkOPLQ9nv7G42Jx2yxm95Onl7uH2c3TxFY1Hya1VMBUKazQHKT3drn0ueIrV3u6lOAslyz_Seia1kxlKGdOC25BUVux6rh42NG6CGuzSeEd0peJEMxPIqaVgTQE26JBcIBMLrXVltNKgXTal1lLphWUTmSuix3XJsWPUTCzjtvU5elNWWpVSS74iGI7lE2x7xP6v1cZNaNRZjTKjBqYX6Nyz_muJyDiH17VUnAtqm-Qd40D</recordid><startdate>2018</startdate><enddate>2018</enddate><creator>Ishimaru, Kazunari</creator><creator>Horiguchi, Naoto</creator><creator>Nojiri, Kazuo</creator><creator>Zhang, Paul Lining</creator><creator>Berger, Paul R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>ESBDL</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>DOA</scope></search><sort><creationdate>2018</creationdate><title>Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018</title><author>Ishimaru, Kazunari ; Horiguchi, Naoto ; Nojiri, Kazuo ; Zhang, Paul Lining ; Berger, Paul R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c354t-578a1826c694a7ffcbbfc35f3d5f0b7adc471734695051818241d964ca80c313</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Circuits</topic><topic>Communities</topic><topic>Design engineering</topic><topic>Design optimization</topic><topic>Electron devices</topic><topic>Meetings</topic><topic>Optimization</topic><topic>Special issues and sections</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ishimaru, Kazunari</creatorcontrib><creatorcontrib>Horiguchi, Naoto</creatorcontrib><creatorcontrib>Nojiri, Kazuo</creatorcontrib><creatorcontrib>Zhang, Paul Lining</creatorcontrib><creatorcontrib>Berger, Paul R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE Xplore Open Access Journals</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Xplore</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Directory of Open Access Journals</collection><jtitle>IEEE journal of the Electron Devices Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ishimaru, Kazunari</au><au>Horiguchi, Naoto</au><au>Nojiri, Kazuo</au><au>Zhang, Paul Lining</au><au>Berger, Paul R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018</atitle><jtitle>IEEE journal of the Electron Devices Society</jtitle><stitle>JEDS</stitle><date>2018</date><risdate>2018</risdate><volume>6</volume><spage>1197</spage><epage>1199</epage><pages>1197-1199</pages><issn>2168-6734</issn><eissn>2168-6734</eissn><coden>IJEDAC</coden><abstract>Performance improvement by simple device scaling is running out of steam. Design and Technology Co-Optimization (DTCO) and System and Technology Co-Optimization (STCO) are the hot topics to overcome scaling issues by collaboration among device, circuit, and system communities. Another approach is seeking device innovation from manufacturing side with material and process communities.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JEDS.2018.2884554</doi><tpages>3</tpages><oa>free_for_read</oa></addata></record> |
fulltext | fulltext |
identifier | ISSN: 2168-6734 |
ispartof | IEEE journal of the Electron Devices Society, 2018, Vol.6, p.1197-1199 |
issn | 2168-6734 2168-6734 |
language | eng |
recordid | cdi_proquest_journals_2298374646 |
source | IEEE Xplore Open Access Journals |
subjects | Circuits Communities Design engineering Design optimization Electron devices Meetings Optimization Special issues and sections |
title | Guest Editorial Special Section on the Second Electron Devices Technology and Manufacturing (EDTM) Conference 2018 |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T06%3A12%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_ieee_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Guest%20Editorial%20Special%20Section%20on%20the%20Second%20Electron%20Devices%20Technology%20and%20Manufacturing%20(EDTM)%20Conference%202018&rft.jtitle=IEEE%20journal%20of%20the%20Electron%20Devices%20Society&rft.au=Ishimaru,%20Kazunari&rft.date=2018&rft.volume=6&rft.spage=1197&rft.epage=1199&rft.pages=1197-1199&rft.issn=2168-6734&rft.eissn=2168-6734&rft.coden=IJEDAC&rft_id=info:doi/10.1109/JEDS.2018.2884554&rft_dat=%3Cproquest_ieee_%3E2298374646%3C/proquest_ieee_%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c354t-578a1826c694a7ffcbbfc35f3d5f0b7adc471734695051818241d964ca80c313%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=2298374646&rft_id=info:pmid/&rft_ieee_id=8576496&rfr_iscdi=true |