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Influence of Poly-AlN Passivation on the Performance Improvement of 3-MeV Proton-Irradiated AlGaN/GaN MIS-HEMTs

To improve the performance of AlGaN/GaN high electron mobility transistors (HEMTs) after exposure to high energy irradiation, 4-nm polycrystalline AlN (poly-AlN) film formed by annealing at 850 °C is proposed to passivate the GaN cap layer. After exposure to 3-MeV proton irradiation with a fluence o...

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Bibliographic Details
Published in:IEEE transactions on nuclear science 2019-10, Vol.66 (10), p.2215-2219
Main Authors: Zhang, Dongliang, Cheng, Xinhong, Shen, Lingyan, Zheng, Li, Gu, Ziyue, Zhou, Wen, Liu, Xiaobo, Yu, Yuehui
Format: Article
Language:English
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Summary:To improve the performance of AlGaN/GaN high electron mobility transistors (HEMTs) after exposure to high energy irradiation, 4-nm polycrystalline AlN (poly-AlN) film formed by annealing at 850 °C is proposed to passivate the GaN cap layer. After exposure to 3-MeV proton irradiation with a fluence of 3×10 14 cm -2 , the ON-resistances (RON) of AlGaN/GaN MIS-HEMTs with SiNx and poly-AlN passivation increase by 28% and 32%, and the dynamic ON-resistances (Rd,ON) degrade by 2000% and 110% with a 30-V OFF-state and a 5-V ON-state drain bias, respectively. The polarization effect of poly-AlN reduces the energy band of the GaN cap layer and compensates for deep-level surface defects, moreover, the growth of AlN by atom layer deposition with low plasma power make the GaN surface smooth, which contributes to the reliability improvement of AlGaN/GaN HEMTs after the proton-irradiation.
ISSN:0018-9499
1558-1578
DOI:10.1109/TNS.2019.2941974