Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction

• Published in: Composites science and technology 2019-09, Vol.182, p.107778, Article 107778
• Main Authors: Lee, Seung Hwan, Yu, Seunggun, Shahzad, Faisal, Hong, Junpyo, Noh, Seok Jin, Kim, Woo Nyon, Hong, Soon Man, Koo, Chong Min
• Format: Article
• Language: English
• Subjects: 3D metal shell network; Beads; Composite materials; Conduction heating; Conductive heat transfer; Copper; Electric contacts; Electrical resistivity; Electroless plating; Electromagnetic shielding; Electromagnetics; EMI shielding; Heat conductivity; Hot pressing; Low percolation; Metal shells; Percolation; Polymer matrix composites; Polymers; Polystyrene resins; Silver; Thermal conductivity
• ISSN: 0266-3538; 1879-1050
• DOI: 10.1016/j.compscitech.2019.107778

Metal-coated polymer bead based composites are promising as electromagnetic interference (EMI) shielding and thermally conductive materials because they form a percolation 3D metal shell network at very low filler content. Herein, we fabricated 3D Cu/Ag shell network composites through electroless plating of metal on polymer beads and a simple hot pressing technique. Cu and Ag shells provide a continuous network for electron and heat conduction; thus, yielding excellent EMI shielding effectiveness of 110 dB at a 0.5 mm thickness and a thermal conductivity of 16.1 W m−1K−1 at only 13 vol % of metal filler. The properties of composites depend on the size of polystyrene (PS) beads and large size metal-coated PS bead composites exhibit higher electrical conductivity, EMI shielding effectiveness, and thermal conductivity than small size bead composites. These results are ascribed to the reduction in the number of contact interfaces between metal-coated beads, which minimizes the interfacial resistance. This study is set to pave the way for designing advanced EMI shielding and thermal conductive materials by a scalable and efficient synthesis approach.