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Decomposition mechanism and kinetics of iso-C4 perfluoronitrile (C4F7N) plasmas
Iso-C4 perfluoronitrile (C4F7N) is one of the most promising alternatives to SF6 for use in power equipment, such as high-voltage circuit breakers, due to its excellent electrical properties and environmentally friendly characteristics. The use of SF6 is being reduced because of its high global warm...
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Published in: | Journal of applied physics 2019-10, Vol.126 (16) |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Iso-C4 perfluoronitrile (C4F7N) is one of the most promising alternatives to SF6 for use in power equipment, such as high-voltage circuit breakers, due to its excellent electrical properties and environmentally friendly characteristics. The use of SF6 is being reduced because of its high global warming potential. To describe the physical and chemical processes occurring in the arc plasma in circuit breakers, both local thermodynamic equilibrium (LTE) and nonlocal chemical equilibrium (LCE) conditions have to be considered. The plasma composition of the arc core region can be calculated under the assumption of LTE by the method of minimization of the Gibbs free energy. The plasma composition of the arc boundary region or during the arc ignition period is not in LTE or LCE, so the use of a chemical kinetic model that considers the effects of the energy barrier in chemical reactions is required. Calculations for both conditions are presented for C4F7N. To develop the chemical kinetic model, the complete decomposition pathway and transition states were first reexamined and further developed. Based on the decomposition pathway, the rate constants of reactions were obtained according to the variational transition state theory method. The results obtained for the two cases provide a reference for the systematic understanding of the decomposition characteristics of C4F7N gas and for related engineering applications. |
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ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/1.5109131 |