THE ORIENTATION OF THE GRAINS AND INDENTATION SIZE EFFECT

The aim of the submitted work is to study the relationship between the orientation of the grains and the Indentation Size Effect (ISE). The micro-hardness was measured by tester Hanemann with applied loads ranged between 0.09807 N to 0.9807 N. The micro-hardness was measured in the middle of in the...

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Bibliographic Details
Published in:Annals of Faculty Engineering Hunedoara 2019-08, Vol.17 (3), p.69-72
Main Authors: Petrík, Jozef, Blaško, Peter, Ďurišin, Juraj, Vasilňáková, Andrea, Guzanová, Anna
Format: Article
Language:English
Subjects:
Copper
Crystallography
Evaluation
Indentation
Mechanical properties
Microhardness
Orientation
Semiconductors
Size effects
Variance analysis
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Summary:The aim of the submitted work is to study the relationship between the orientation of the grains and the Indentation Size Effect (ISE). The micro-hardness was measured by tester Hanemann with applied loads ranged between 0.09807 N to 0.9807 N. The micro-hardness was measured in the middle of in the center of each of the four grains of the sample - the copper of semiconductor quality (99.995 %). The influence of the load and the orientation of the grains on the micro-hardness and the ISE was evaluated by the Analysis of Variance (ANOVA), it is statistically significant for both factors. The presence and character of ISE were evaluated using Meyer's index n, PSR method, and Hays - Kendall approach. The relationship between the crystallographic orientation of the grain and ISE was confirmed.
ISSN:1584-2665
2601-2332