Analysis of Kinetic and Nucleation Mechanisms of Electrodeposited Copper on Indium Tin Oxide Thin Films

In this paper, we report an electrochemical study using cyclic voltammetry and chronoamperometry on the kinetic and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide-coated glass substrates from sulfate solutions. The present investigation has been carried out in an acid sol...

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Bibliographic Details
Published in:Journal of electronic materials 2020-02, Vol.49 (2), p.1308-1313
Main Authors: Nehaoua, K., Zouaoui, A., Khaniche, B., Satour, F. Z., Zegadi, A.
Format: Article
Language:English
Subjects:
Atomic force microscopy
Characterization and Evaluation of Materials
Chemistry and Materials Science
Coated electrodes
Copper
Diffusion
Diffusion coefficient
Electronics and Microelectronics
Glass substrates
Indium tin oxides
Instrumentation
Materials Science
Morphology
Nucleation
Optical and Electronic Materials
Solid State Physics
Thin films
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Summary:In this paper, we report an electrochemical study using cyclic voltammetry and chronoamperometry on the kinetic and nucleation mechanisms of electrodeposited copper on indium-doped tin oxide-coated glass substrates from sulfate solutions. The present investigation has been carried out in an acid solution at pH = 5. The Scharifker–Hills model was used to analyze current transients. At relatively low overpotentials, copper deposition is observed to follow a model that involves instantaneous nucleation and diffusion-controlled 3D growth. The diffusion coefficient for Cu 2+ for various applied potentials is determined. Atomic force microscopy (AFM) has been used to check the surface morphology of the electrodeposited thin films.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-019-07793-4