Computational studies on laminar flow in micro-channel heat sinks for electronic cooling applications

A numerical model with fully developed laminar flow is presented and is used to analyze a three-dimensional micro channel heat sink subjected to constant heat flux boundary condition. The substrate material is silicon and water is used as the coolant. A uniform heat flux is applied at the bottom sur...

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Bibliographic Details
Main Authors: Manjunath, H. N., Naveen, K. S., Babu, N. Ramesh, Aithal, Kiran, Veda, S. N.
Format: Conference Proceeding
Language:English
Subjects:
Boundary conditions
Computational fluid dynamics
Fluid flow
Heat
Heat flux
Heat sinks
Heat transfer
Laminar flow
Microchannels
Numerical models
Pressure effects
Reynolds number
Silicon substrates
Three dimensional analysis
Wall temperature
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Summary:A numerical model with fully developed laminar flow is presented and is used to analyze a three-dimensional micro channel heat sink subjected to constant heat flux boundary condition. The substrate material is silicon and water is used as the coolant. A uniform heat flux is applied at the bottom surface of the heat sink. The analysis has been carried out for fluid flows of Reynolds number less than two hundred. In the current investigation five cases with different channel dimensions have been considered. Each case is analyzed with four different pressure drops and two different heat fluxes. The effect of different pressure drops and channel dimensions on various variables like mean temperature of the fluid, channel wall temperature, temperature at channel outlet, Nusselt number and velocity is being investigated.
ISSN:0094-243X
1551-7616
DOI:10.1063/1.5141588