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First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm−2

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of...

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Bibliographic Details
Published in:Journal of instrumentation 2019-06, Vol.14 (6)
Main Authors: Meschini, M, Ceccarelli, R, Dinardo, M, Gennai, S, Moroni, L, Zuolo, D, Demaria, L, Monteil, E, Gaioni, L, Messineo, A, Currás, E, Duarte, J, Fernández, M, Gómez, G, García, A, González, J, Silva, E, Vila, I, GF Dalla Betta, Mendicino, R, Boscardin, M
Format: Article
Language:English
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Summary:Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.
ISSN:1748-0221
DOI:10.1088/1748-0221/14/06/C06018