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First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm−2
Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of...
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Published in: | Journal of instrumentation 2019-06, Vol.14 (6) |
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Main Authors: | , , , , , , , , , , , , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that cite this one |
Online Access: | Get full text |
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Summary: | Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm−2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation. |
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ISSN: | 1748-0221 |
DOI: | 10.1088/1748-0221/14/06/C06018 |